| 摘要 |
A method for fabricating a light emitting diode lamp in a simplified procedure, and a high-output LED, that has a simple structure and can exhibit improvement in heat release property, fabricated by using the method which includes the steps of coating an insulating layer on a substrate and etching the insulating layer using a mask pack, coating a conductive metal layer on the insulating layer, forming an electrode pattern and a recess, on which an LED chip is mounted, on the metal layer using the mask pack, attaching the LED chip to the top of the recess, connecting a wire to the electrode pattern, and mounting a reflector having a vertical opening hole around the LED chip on the substrate to reflect light emitted from the LED chip in all directions, and molding the top of the substrate from a transparent resin to cover the LED chip, the electrode pattern and the reflector. |
