SURFACE PROCESSING METHOD FOR MOUNTING STAGE

摘要

A surface processing method for mounting a stage is provided to form a mounting surface corresponding to a substrate by planarizing the mounting surface. A wafer(W) is transferred into a chamber and is mounted on a mounting surface of the ESC(ElectroStatic Chuck)(S31). A high DC voltage is applied to the electrostatic electrode plate so that the wafer is electrostatically attracted to the mounting surface(S32). A processing gas is turned into plasma in a processing space(S33). The remaining processing gas is exhausted out of the chamber and the wafer is transferred out from the chamber(S34). The integrated time period of the radio frequency electrical power is compared with a predetermined time period(S35).