SEMICONDUCTOR INTEGRATION CIRCUIT DEVICE

摘要

PURPOSE:To improve manufacture efficiency and size accuracy by forming a microgroove near an integrated circuit element or near the connection parts of metal wires and sticking and fixing a lead frame to an integrated circuit element so as to seal each member excepting the terminal surface with epoxy resin or the like. CONSTITUTION:In order to be connected to an external equipment, a microgroove 2 is formed on one side surface of a lead frame 1 processed to a fixed terminal pattern near a junction parts of metal wires 8. An integration circuit element 4 is stuck and fixed through an adhesive 3 for being connected to the lead frame 1 by metal wires 5. Each said member is sealed with sealing resin 6 exposing the other side surface of the lead frame 1. Thereby, a needless amount of the adhesive 3 is absorbed by a microgroove 2 so as not to be exposed to the terminal surface of the lead frame 1 and not to flow out to the junction parts of the metal wires 5. Thereby, using a cheap lead frame, a commonly-known resin molding method can be applied to semiconductor integrated circuit device of the present invention.