| 摘要 |
PURPOSE:To eliminate the generation of a welding failure and to execute laser welding with high accuracy by sticking each extra thin plate member to an adhesive tape in a desired state, and thereafter, holding the whole by a jig and executing the laser welding. CONSTITUTION:A pin lead stock 1 for a ceramic package of an IC is formed by an etching from a hoop stock. To the side to be brazed to the ceramic package of this lead stock 1, a ribbon material 2 is brought to laser spot welding. To an adhesive tape 3, the ribbon material 2 is stuck at a prescribed interval, and the lead stock 1 is superposed and stuck there on, respectively. Subsequently, said stock is placed on an electromagnetic table 4 of a plate with this adhesive tape 3 up, a jig 5 is superposed and placed, and by electromagnetic force of the electromagnetic table, the jig is attracted magnetically and held. In the longitudinal direction of the jig 5, a hole 6 of a prescribed diameter is provided, and from this hole 6, laser welding is executed, and the ribbon material 2 is brought to spot welding to the lead stock 1. In such a way, the laser welding can be automatized with high accuracy. |
