| 摘要 |
PURPOSE:To form a coating film having satisfactory electrical conductivity on a Ti material by subjecting the Ti material to degreasing, etching, electroless Ni striking, Ni plating, aging and gold plating. CONSTITUTION:A Ti material member 1 is degreased and etched by immersion in an aq. soln. contg. hydrochloric acid at a required temp. for a required time. The member 1 is subjected to electroless Ni striking 2 with a bath consisting of nickel chloride, sodium citrate, ammonium chloride and an aq. ammonium soln. and an electroless Ni plating layer 3 is formed as usual. The member 1 is then aged at 540 deg.C for a required time and a gold plating layer 4 is formed as usual. Thus, a coating film having stable, satisfactory electrical conductivity can be formed on the Ti material. |
