| 摘要 |
<p>PURPOSE:To reduce the size of a thick film circuit substrate approximately to half, by laminating two thick film circuit substrates, printing a printing element on the opposite back side, rear, and connecting electrically a conductor pattern of the both substrates using cream solder to divide into two substrates, then laminating them. CONSTITUTION:Screen process printing including through-hole printing is carried out on the both sides of ceramic substrates 5 and 6 to form a conductor pattern 2 which is conducted by a through hole 7. After a printing element such as a resistance or a capacitor is formed on the opposite surface by printing, a protective glass 8 is printed to cover the conductor pattern 2 and the printing element 3 excepting a connecting terminal section 2a of the conductor pattern 2. Then a cream solder 9 is printed on the connecting terminal section 2a which is formed on the each opposite surface of the two thick film circuit substrates. After an adhesive 10 is applied on the edge of the substrate 1, the two ceramic substrates 5 and 6 are fixed laminating the opposite surfaces thereof. Finally, the cream solder 9 is reflowed to conduct the conductor pattern 2 of the ceramic substrates 5 and 6.</p> |
