| 摘要 |
PURPOSE:To contrive the improvement of a stability to depend upon a process for connecting parts, at which connections are performed using a fine metal wire, by a method wherein the connection between one end of the fine metal wire and a metallized side heterogeneous from the fine metal wire is first performed and then, the connection between the other end of the fine metal wire and a metallized side homogeneous as the fine metal wire is performed. CONSTITUTION:In a process for connecting a semiconductor element and an external lead wire to each other by a fine metal wire, the connection between one end of the metal wire and a metallized side heterogeneous from the metal wire is first performed and then, the connection between the other end of said metal wire and a metallized side homogeneous as the metal wire is performed. By connecting first the metal wire and the surface of a lead on the heterogeneous metallized side to each other, a deformation width in said process can be lessened. Therefore, a stability at a time when the other end of said fine metal wire and the surface of a chip on the homogeneous metallized side are next connected to each other is considered and the reliability at both connecting parts is improved. |
