| 摘要 |
<p>Provided is a wiring board whereupon either a front surface incident type or a rear surface incident type solid-state imaging element can be mounted. The solid-state imaging device is also provided. The wiring board (1) having a region (1a) whereupon the solid-state imaging element is to be arranged is provided with a plurality of first electrode pads (12) formed inside the region (1a), and a plurality of second electrode pads (13), which are formed outside the region (1a) and are electrically connected to each of the first electrode pads (12). Furthermore, the solid-state imaging device has the rear surface incident type solid-state imaging element or the front surface incident type solid-state imaging element on the wiring board (1).</p> |
