| 摘要 |
PURPOSE:To reduce the dispersion of the deformation quantity of a polishing cloth and obtain the uniform polishing pressure distribution by installing a mechanism for locally dressing the swing edge part of the polishing cloth where abrasion difference is generated between the swing edge part and the swing center part, accompanied with the swing polishing of a wafer. CONSTITUTION:A wafer holding plate 2 is reversely swung in the diameter direction of a working surface plate 3 by the reciprocating movement of a cylinder 8, and a wafer 1 held by the holding plate 2 is pressed onto a polishing cloth 15 on the working surface plate 3 in revolution, and polishing work is carried out. When the polishing worked wafer 1 is to be replaced, a dressing plate 18 is attached onto the working surface plate 3, and revolved by a driving motor 19, and the specific part (swing edge part of the wafer) of the polishing cloth 15 is dressing-worked by the dressing plate 18. Therefore, the dispersion of the deformation quantity of the polishing cloth 15 is reduced, and the polishing pressure distribution is made uniform, and the wafer is polished with high precision. |
