| 摘要 |
PURPOSE:To uniformly bond a wafer in high flatness, by evacuating the opposite side of the wax coated face of the wafer in vacuum, curving the wafer, bringing the wafer into contact with a carrier plate, raising pressure at the opposite side of the wax coated face and bringing the wax coated face to the plate. CONSTITUTION:The opposite side of the wax 13 coated face of a wafer 12 is evacuated in vacuum, the face at the opposite side of the wax coated face is supported and the wafer 12 is curved in such a way that the wax coated face becomes a protruded spherical surface. The top of the wax coated face of spherical surface is brought into contact with a carrier plate 14. Then pressure at the opposite side of the wax coated face of the wafer 12 is raised, the wax coated face is brought into contact with a carrier plate 14 from the top of the wax coated face of spherical surface to the peripheral part and the wafer 12 is placed on the carrier plate 14. |
