| 摘要 |
A lead frame has a stage (3a;3b) for mounting a semiconductor element, leads (51a to 57a ; 51b to 58c) disposed around the stage, and an outer frame (11a, 12a, 61a, 62a ; 11b, 12b, 61b, 62b) supporting the leads.
<??>Some leads (51a, 53a, 55a, 57a ; 51b, 53b, 55b 57b) have reduced-width lead parts between the outer frame and the stage. Supporting bars (100a, 101a, 102a, 103a ; 100b, 101b, 102b, 103b) connect the reduced-width lead parts to the outer frame.
<??>The reduced-width lead parts may be as narrows as is possible to make them by metal punching, the supporting bars allowing safe handling of those parts during fabrication of a packaged semiconductor element using the lead frame. |
