| 摘要 |
PURPOSE:To prevent stress generated during a process of bending outer leads from being directly applied to a sealing member and to prevent damages thereto, by bending the outer leads before performing the resin sealing process in manufacture of a resinsealed semiconductor device. CONSTITUTION:A lead frame comprising an island 6 on which a semiconductor element 7 is secured, outer leads 2 and inner leads integral with the outer leads 2 is prepared. Electrodes of the semiconductor element 7 are connected with the inner leads by means of bonding wires 9. The lead frame is fixed by upper and lower molds 4, 5 and the outer leads 2 are bent by means of a bending punch 3. Then, the semiconductor element 7, the island 6, the bonding wires 9 and the inner leads are sealed with resin 1. |
