| 摘要 |
PURPOSE:To enable a chip to be sealed hermetically without melting a chip seal, by providing a resistance heat generating body in direct contact with a cap, the resistance heat generating body being adapted to supply an enough quantity of heat to heat a hermetic seal to a temperature higher than the melting point of the hermetic seal, while providing another resistance heat generating body in direct contact with a base, said another resistance heat generating body being adapted not to heat the chip seal to a temperature higher than the melting point thereof. CONSTITUTION:A chip 2 is disposed on a second resistance heat generating body 8, and a chip seal 3 is heated in order, to secure the chip 2 to a ceramic package 1 through eutectic coupling or the like. Then, a cap 6 is disposed on the top 1c of a base 1 with a hermetic seal interposed therebetween. Wires of Au, Cu or the like are connected to the base 1. A first resistance heat generating body 7 is put in direct contact with the cap 6. The first and second resistance heat generating body 7 and 8 are supplied with current. Since the first resistance heat generating body 7 has a smaller cross section than that of the second resistance heat generating body 8, the first generating body 7 generates more heat than the second heat generating body 8. Thus, the cap 6 can be secured to the base 1 without melting the chip seal 3 or hermetic seal 5. |
