| 摘要 |
PURPOSE: To relieve the mechanical stress and to prevent the disconnection by connecting a metallic thin wire for connecting a chip of a module IC and a lead-through lead at a left side or an upper side of a chip to be located on a position further than a center line of the long and short sides of a card. CONSTITUTION: A chip 1 is adhered to a module IC 5 to be inserted between the IC cards 7, and then is connected with a lead-through lead 2 by a metallic thin wire 3. In the case of one-chip module, the number of connections is small, that is, eight or six, so that it is designed in advance that the metallic fine wire 3 is located on the left side or upper side when the module IC is inserted between the cards 7. By locating the metallic fine wire 3 further than a center line of the long and short sides of the card 7, the mechanical stress to the metallic thin wire 3 can be relieved when the card bending stress is applied. Whereby the disconnection of the metallic thin wire can be prevented. |
