| 摘要 |
PURPOSE: To improve the softness and follow-up property to the bending of an IC card by forming a rigid part by molding a resin on only the central part of an IC module to form a convex section having a specific area ratio and a specific size. CONSTITUTION: An IC module 6 buried in an IC card substrate 20, is manufactured by forming a terminal layer 2 for external connection on one face of a supporting layer 1 of an IC module substrate 3, forming a circuit pattern layer having a bonding pad on the other face, loading an IC chip 4, and molding only the periphery of the IC chip with a resin 5 to form a convex section. On this occasion, an area ratio in the flat direction of the resin mold part 5 is 40% or less of the total IC module substrate 3, the flat shape of the resin mold part 5 is almost square, and a length of one side is 9 mm or less. Whereby the stress applied to the resin mold of the IC module can be effectively reduced when the card is bent, and the breaking, cracking and dropping can be prevented. |
