Copper-iron-nickel composite material for electrical and electronic applications

摘要

The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention consist essentially of about 10% to 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred composite materials have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1.