| 摘要 |
PURPOSE:To enable a minute circuit pattern and make a solder property good by laminating an easily peeling-off layer, a copper foil bonding adhesive layer, a fixed circuit pattern-etched copper foil and a transfer adhesive layer on a base film in the order thereof. CONSTITUTION:An electrically conductive circuit transfer foil has a formation in which a base film 1, an easily peeling-off layer 1a, a first insulating layer 2, a copper foil bonding adhesive layer 3, a fixed circuit pattern etched copper foil 4, a second insulating layer 6 and a transfer adhesive layer 7 are laminated in the order thereof. The first insulating layer 2 and the second insulating layer 6 are arbitrary layers provided at need. Transferring an electrically conductive circuit transfer foil having laminated formation to a transfer material is performed by method in which a molded product is performed in a procedure of hot stamping and another method which with a copper foil attached to a die during molding, a material is molded and at the same time a circuit is transferred in a procedure of in-mold stamping. |
