发明名称 LAMINATE FOR FORMING BEAM LEAD FOR IC CHIP BONDING
摘要 PURPOSE: To ensure a laminate which has excellent bonding properties and flexibility, and size stability and hardness at 200 deg.C or higher treatment temperature by employing a mixture of a polymer binder having glass transition temperature at a specific temperature and a photopolymerizable monomer comprising a monomer having a specific structure. CONSTITUTION: A laminate includes a first resist layer bonded with one surface of a flexible metal piece and a second resist layer bonded with an opposite surface of the metal piece, and the second resist includes a polymer binder having 150 deg.C glass transition temperature, a photopolymerizable monomer mixture comprising a monomer having a structural formula I and a monomer having a structural formula II (in the formulae, q is 1, 2, 3 or 4, b is 1 or 2, m and p are an integer of 1 to 10, and R and R1 are individually H or CH3 ) and a photoinitiator composition.
申请公布号 JPH0198236(A) 申请公布日期 1989.04.17
申请号 JP19880182842 申请日期 1988.07.23
申请人 EASTMAN KODAK CO 发明人 JIERARUDO DABURIYU KURAIN;ROBAATO SHII MAKONKII;MAIKERU EFU MORAIA;JIYON EMU NUUNAN
分类号 H01L21/60;G03F7/033;G03F7/095;G03F7/26;H05K3/00;H05K3/06;H05K3/40 主分类号 H01L21/60
代理机构 代理人
主权项
地址