发明名称 MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To form a necessary circuit in a first layer and a fourth layer and connect each layer by synchronizing and laminating nonconductive part composed of a second and a third layers which show middle layers and freely applying said part as a set position of a through hole from the first layer and the fourth layer. CONSTITUTION:Inner layer boards 1, 2 for a second layer and a third layer providing a necessary circuit in the middle of a first and a fourth layers are arranged, the inner layer board 1 forms quadrangle 6 in which a pair of two linear circuit 4 parallelly and alternately projecting on a substrate 3 have an intermittent part and the inner layer board 2 is grid-shapedly arranged in a conductive 8 in which a circular non- conductive part 7 is composed of copper foils on the substrate 3. The inner layers 1, 2 are laminated at the size and the position relation in which four nonconductive parts are arranged in the inside of the quadrangle 6 and two nonconductive parts between the quadrangle 6. The connecting holes of the first layer and the second layer agree with each edge of the circuit 4 and laminated so as to position a through hole in the inside of or between quadrangle 6 and in order that the through hole of the third layer and the fourth layer is positioned at the center of a nonconductive part 7 and its connecting hole is overlapped on the conductive part 8.</p>
申请公布号 JPH0198296(A) 申请公布日期 1989.04.17
申请号 JP19870256666 申请日期 1987.10.12
申请人 AIKA DENSHI KK 发明人 HEIKO TAKESHI;TSURUMOTO YOSHITAKA
分类号 H05K3/46 主分类号 H05K3/46
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