| 摘要 |
In subassemblies having components through which electric current flows, there is the problem of dissipating heat in a pinpointed and highly efficient manner. For this purpose, a cooling element (7) is fitted with a spiral coolant line (20-24), which is located as near as possible to at least one surface (25, 26). The spiral shape of the coolant line (20-24) is particularly suitable, since in most active semiconductor elements heat is to be dissipated by a circular surface. A method for producing cooling elements is suitable, in particular for mass production on a pressure die-casting machine. In this process, the coolant line is positioned during the actual casting process by means of supports (15) and a controllable core (16a). <IMAGE> |
