| 摘要 |
PURPOSE:To simplify alignment by putting marking for alignment at least either on a mounting substrate or on a semiconductor element and aligning these marks. CONSTITUTION:A land pattern 2 consisting of a Cu foil is formed onto the surface of a mounted substrate 1 composed of glass epoxy, etc. An alignment mark 4 is prepared at the central section of the land pattern 2. A bare IC chip 7 with no package is superposed while a pattern surface is directed downward. An alignment mark 4 such as a cross is shaped to the pattern surface in the IC chip 7, and the alignment mark 4 and the mark 4 on the substrate 1 are conformed by transmitting the IC chip 7 by an infrared microscope 8 from the upper section of the IC chip 7. Al electrodes 6 as external electrodes are shaped onto the surface of the IC chip 7 at that time, and bumps 5 as metallic balls composed of Au, etc., for electrical connection to the electrodes 6 are formed through a plating method, a transfer method, etc. The bumps 5 and solder coatings 3 are joined through heating and pressing from the upper section of the IC chip 7. Lastly, the whole surface is coated with a resin 9 for protecting the IC chip 7.
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