METHOD AND APPARATUS FOR BONDING COVER PLATE TO EDGE SURFACE OF BOARD LIKE WORK

摘要

In the said process it is provided that the end sides and/or edge parts are provided solely in a central region with a hot-melt adhesive which has a relatively low resistance to ambient influences whilst an adhesive with a relatively greater resistance to ambient influences is applied to the edge zones on both sides of this central region. In a device for carrying out this process, the application width and the arrangement of a first nozzle for hot-melt adhesive is such that the hot-melt adhesive coating is made merely in the central region of the end side of the work piece or of the edge part. A second and a third nozzle are constructed and arranged with respect to the work piece and/or edge part in such a way that the application of the adhesive with the relatively greater resistance occurs only in the edge zones on both sides of the central area provided with hot-melt adhesive.