发明名称 VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method capable of accurately measuring film thickness.SOLUTION: A vapor deposition apparatus includes a vacuum chamber 1, a piping part 2 installed in the vacuum chamber, a vapor deposition source 3 arranged in the piping part, and a heater 9 to heat the piping part and the vapor deposition source. A gas material evaporated or sublimated from the vapor deposition source is deposited on a substrate 4 arranged in the vacuum chamber. The vapor deposition apparatus further includes a gas amount control valve 6 arranged in the piping part to control an amount of the gas evaporated or sublimated from the vapor deposition source, and a gas concentration acquisition device 100 to acquire gas concentration in the piping part after changing the amount of the gas evaporated or sublimated from the vapor deposition source by opening or closing the gas amount control valve.SELECTED DRAWING: Figure 1
申请公布号 JP2016108579(A) 申请公布日期 2016.06.20
申请号 JP20140244332 申请日期 2014.12.02
申请人 PANASONIC IP MANAGEMENT CORP 发明人 NAGAI HISAO;OKUMA TAKAFUMI;SUETSUGU DAISUKE;KOISHIZAKI TSUYOSHI
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
代理机构 代理人
主权项
地址