发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To improve productivity and to enable a mold with stable quality to be obtained by providing a heat insulating material between the head and main unit of a plunger which advances or retreats within a pot. CONSTITUTION:A heat insulating material 13 for preventing transmission of heat is provided between a plunger main unit 11a and a coupler 11b and a through hole 14 is provided at the central part to allow a coupling bolt 12 to be inserted through. In a semiconductor resin sealing device thus constituted, the part between a plunger main unit 11a and a head 11c is insulated against heat so that transmission of heat of the head 11c to the drive device side can be prevented. Thus, since a plunger 11 is provided with a function for keeping temperature of the head 11c on sealing resin, a tablet 3 within a chamber 1a can be fully heated by heat from a pot 1 to increase curing speed of the tablet 3.
申请公布号 JPH0196937(A) 申请公布日期 1989.04.14
申请号 JP19870255356 申请日期 1987.10.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUTSUMI KOJI;TANAKA SUEKICHI
分类号 B29C45/02;B29C45/58;H01L21/56 主分类号 B29C45/02
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