| 摘要 |
PURPOSE:To stabilize power supply voltage effectively by adopting the film carrier system and by arranging a capacitor for decoupling of comb-type electrode near the position where integrated circuit chip is mounted. CONSTITUTION:In the TAB substrate, a lead wire was formed on a resin film 1 such as polyimide by photo etching. A capacitor for decoupling with a pattern where comb-type electrodes 61 and 62 are engaged by etching is formed at the tip of an inner lead part 3 where integrated circuit chip is mounted. One of the electrodes 61 and 62 is connected to the power supply potential and the other is connected to the grounding potential. An integrated circuit chip 2 is arranged on the surface which is opposite to the one where lead wiring is formed and the inner lead part 3 is connected to a protruded electrode 8 through a through wiring 7. The through wiring 7 should be formed before applying the Cu film to the resin film 1. And the integrated circuit chip 2 and capacitor are arranged to a position where they nearly overlap. Since a rush current flows to the power supply line in the integrated circuit chip, the capacitor for decoupling should be placed closer to the integrated circuit chip. |
