发明名称 Adhesive film and flat cable using the same
摘要 There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.
申请公布号 US9376596(B2) 申请公布日期 2016.06.28
申请号 US201313782510 申请日期 2013.03.01
申请人 HITACHI METALS, LTD. 发明人 Shanai Daisuke;Abe Tomiya
分类号 H01B5/14;B32B27/34;C09J7/02;H01B7/08;H01B7/295;B32B27/06;B32B27/18;B32B27/36;C08K3/00;C08K5/00;C08K5/29;C08K3/22 主分类号 H01B5/14
代理机构 Fleit Gibbons Gutman Bongini & Bianco PL 代理人 Bianco Paul D.;Fleit Gibbons Gutman Bongini & Bianco PL
主权项 1. An adhesive film, consisting of: an insulator film; an adhesive layer formed on the insulator film, the adhesive layer made of a material containing any one of resins of polyester, thermoplastic polyurethane, and copolyamide; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a material containing a mixed resin composition, the mixed resin composition consisting of a copolyamide and a non-crystalline resin; wherein the copolyamide is a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and the non-crystalline resin consists of a non-crystalline copolyamide or non-crystalline polyester; wherein a content of the non-crystalline resin is 10 pts. wt. or more and 80 pts. wt. or less, with respect to 100 pts. wt. of the copolyamide; and wherein the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.
地址 Tokyo JP