ENCAPSULANT FOR PACKAGING AN ORGANIC ELECTRIC DEVICE FOR DISPLAY WITH LOW THERMAL EXPANSION COEFFICIENT

摘要

Provided is a metal material of an encapsulant for packaging an organic electric device. According to the present invention, steel for an organic light emitting diode encapsulant for a display comprises: an amount equal to or less than 0.02 wt% of C (excluding 0 wt%); an amount equal to or less than 0.4 wt% of Si (excluding 0 wt%); an amount equal to or less than 0.5 wt% of Mn (excluding 0 wt%); an amount equal to or less than 2.0 wt% of Cr (excluding 0 wt%); 39-41 wt% of Ni; an amount equal to or less than 0.6 wt% of Co (excluding 0 wt%); and the remainder consisting of Fe and inevitable impurities.