发明名称 HEAT BLOCK FOR WIRE BONDING DEVICE
摘要 PURPOSE:To enable die pat to be loaded stably, heat of heat block to be transmitted positively, and positive wire bonding to be made by mounting a guide plate with a thickness which is approximately equal to the ejection dimensions of die pat and in that a penetration hole where die pat and connecting part are inserted is formed. CONSTITUTION:In a guide plate 21, a penetration hole 21a where a die pat 4 and connecting part is inserted is formed and the thickness dimensions are approximately equal to the ejection dimensions of the die pat 4. Also, this guide plate 21 is mounted to the upper surface of a heat block main unit 1 by a screw 12 and can be replaced according to the shape of the die pat 4 of lead frame to be used. Thus, in a heat block where this kind of guide plate 21 was mounted, the die pat 4 is inserted into the penetration hole 21a and the rear surface closely contacts the heat block 1.
申请公布号 JPH0196940(A) 申请公布日期 1989.04.14
申请号 JP19870255368 申请日期 1987.10.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORI RYUICHIRO
分类号 H01L21/60 主分类号 H01L21/60
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