| 摘要 |
PURPOSE:To prevent a clad target from thermally adhering to a backing plate by joining a target material to a high-purity Ag substrate with a specific condition to form a clad target and then attaching the above to a backing plate. CONSTITUTION:At the time of manufacturing a sputtering target, a target material 1 is joined to an Ag sheet 4 having >=99.5% purity and containing 100-5,000wt.ppm, in total, of at least one or more elements among Zn, In, Mn, Sb, Be, Ca, Cr, Te, Y, Nb, Mo, Ta, and Sn by a metal bonding agent 5 so as to be formed into a clad target 6, which is attached to a backing plate 3 made of Cu by means of an annular mounting fixture 2. Since this target is free from thermal adhesion between the backing plate 3 and the clad target 6 during use, the clad target 6 can be easily separated from the backing plate 3. |
