| 摘要 |
PURPOSE:To prevent pins of semiconductor package from being adversely affected in transit by providing a pair of protrusions on the upper surface of a semiconductor package and a pair of slits on a lid corresponding to the protrusions to prevent the package from moving within a semiconductor container. CONSTITUTION:A slit 3a and a protrusion 3b are formed in a semiconductor package 3 in pairs. Since the slit 3a is set on a protrusion 2, a semiconductor package 3 keeps a pin 3c out of contact with an inner wall 5 thus avoiding horizontal movement. Furthermore, since the protrusion 3b is set in a slit 4a of the lid 4, supporting efficiency is further assured making it possible to hold the package even in perpendicular movement. The semiconductor package 3 is thus fixed, always keeping the pin 3c out of contact with the inner wall. A semiconductor package can be thereby transported in safe. |
