发明名称 WAFER ALIGNMENT MARK
摘要 <p>PURPOSE:To remove misalignment among a plurality of processes and reduce errors of alignment by dividing one alignment mark into a plurality of segments and forming divided alignment marks for alignment of each process at each part of divided construction prior to a process for carrying out each alignment. CONSTITUTION:One alignment mark is divided into a plurality of segments and the divided alignment mark for alignment of each process is formed at each part of divided construction prior to a process for carrying out each alignment, thereby making them to be one alignment mark. For example, one divided alignment mark 32 is used as a slit formed in an active region forming process and another alignment mark 33 is used as a slit formed in a gate forming process. Centers 37 and 38 of the slits formed in the active region and the gate forming processes, respectively, are determined by using respective alignment marks as one alignment mark to seek a center 39 of the slit between the active region and the gate.</p>
申请公布号 JPH0194616(A) 申请公布日期 1989.04.13
申请号 JP19870250685 申请日期 1987.10.06
申请人 OKI ELECTRIC IND CO LTD 发明人 ONODERA TOSHIO;TAGUCHI TAKASHI
分类号 G03F9/00;H01L21/027;H01L21/30;H01L21/68 主分类号 G03F9/00
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