| 摘要 |
PURPOSE:To improve productivity of an automatic molding apparatus and to decrease a price of such apparatus, by arranging a plurality of loading frames on the outer periphery of a rotary body rotatable around one of support columns and adapting the apparatus such that the loading frame carrying a semiconductor lead frame thereon is clamped by a molding tool so that resin is molded with the lead frame. CONSTITUTION:An automatic molding apparatus comprises a lower base 21, three or more support columns 23, an upper base 22, a movable base 25, a vertical moving means 24, a molding tool 26 having a bottom mold 26b and a top mold 26a and a resin injecting means. The automatic molding apparatus is further provided with a rotary body 31 rotatable around one of the columns 23 and also movable vertically, a plurality of loading frames 42 arranged on the outer periphery of the rotary body 31 at approximately equal intervals and each capable of carrying a semiconductor lead frame, a rotating means for rotating the rotary body 31 by a predetermined angle and a second vertical moving means for moving the rotary body 31 vertically. The loading frame 42 carrying the semiconductor lead frame is clamped by the molding tool 26 so that resin is molded with the lead frame. |
