| 摘要 |
<p>PURPOSE:To improve the bonding intensity of pins by filling the holes of the ceramic green sheet on a ceramic substrate for vertically providing pins with a filler containing a ceramic powder or a glass powder and a conductor, vertically providing the pins in the holes, and calcining the ceramic green sheet and the filler at a temperature lower than the calcination temperature of the substrate. CONSTITUTION:On a ceramic substrate 2, a ceramic green sheet 6 having a calcination temperature lower than that of the ceramic substrate 2 is provided which has throughholes 8 opened in the positions where pins 10 are to be vertically provided, then the throughholes 8 are filled with a filler 12 containing at least either a ceramic powder or a glass powder and a conductor 4 and vertically provided with the pins 10, and under this condition, the ceramic green sheet 6 and the filler 12 are calcinated at a temperature lower than the calcination temperature of the ceramic substrate 2. Accordingly, the pins 10 have their head buried in the ceramic sheet 6 and bonded with the ceramic and glass in the filler 12. With this, the bonding intensity of the pins can be enhanced.</p> |
