| 摘要 |
PURPOSE:To allow a panel copper plating layer to be plated on a printed board with an increased plating strength when such printed board is formed using a fluororesin as the substrate by providing a process in which the printed board is dipped in an aqueous solution of oxide agent prior to being dipped in a fluororesin surface treatment solution. CONSTITUTION:After forming a printed board 1 by pressure stacking a substrate consisting of a fluororesin which uses a glass fiber as the core material, a through hole being formed therein, and dipping the printed board in a fluororesin surface treatment solution, a pattern copper-clad layer is formed on the surface of the printed board. When preparing a printed board in such a way, said printed board 1 is dipped in an aqueous solution 5 of an oxide agent prior to being dipped in the fluororesin surface treatment solution 6. For example, said printed board 1 is dipped in an aqueous solution, in which 30-60gr of KMnO4 is dissolved into 1l of water and which is maintained at temperature 70-90 deg.C, for 1-2 minutes. Then after dipping it in the fluororesin surface treatment 6 based on sodium naphthalene at ambient temperature for 5-10 minutes, a panel copper-plated layer of a double layer structure having an electroless copper plated layer and a electrolytic copper plated layer is obtained by plating. |
