PROCESS FOR MAKING SUB-MICROMETRIC STRUCTURES AND USE OF THIS PROCESS IN MAKING DEEP DIELECTRIC ISOLATION REGIONS WITH A SUB-MICROMETRIC WIDTH IN A SEMICONDUCTOR BODY
摘要
申请公布号
DE3379363(D1)
申请公布日期
1989.04.13
申请号
DE19833379363
申请日期
1983.10.05
申请人
IBM DEUTSCHLAND GMBH;INTERNATIONAL BUSINESS MACHINES CORPORATION