发明名称 MOLDING METHOD OF RESIN MOLD WITH SKIN MATERIAL
摘要 PURPOSE:To attain a sufficient adhesive effect and cost-down of a skin material by a method wherein a number of fine holes are made on the face for bonding the skin material, a parison of a base material is deformed after the molding face with the skin material, resin to be filled in the fine holes is made to be connection cutting into the skin material. CONSTITUTION:A skin material 2 in provided with many fine holes 5 in a proper depth to the surface (face to be bonded) of a foam layer 4 before the skin material is bonded to a base material 1. In the molding process, the skin material 2 is placed on a mold 6 in one side so that the foam layer 4 side may oppose to the base material 1. Parison (the base material 1) is extruded between both molds, which are closed and air is blown thereinto to make the parison follow after the mold face to be molded. In this case, the skin material is pushed on the mold face with the expansional deformation of the parison, and is bonded on the material 1 face, resin cuts into the fine holes 5 on the foam layer 4 from the material 1 side to make 'connection foot'.
申请公布号 JPH0195027(A) 申请公布日期 1989.04.13
申请号 JP19870252859 申请日期 1987.10.07
申请人 KOJIMA PRESS CO LTD 发明人 TSUCHIYA KOICHI;HISATOMI SHINGO
分类号 B29C49/20;B29C49/04;B29C49/24;B29L22/00;B29L31/30 主分类号 B29C49/20
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