发明名称 POSITIONING DEVICE OF DIE FOR INNER LEAD BONDER
摘要 <p>PURPOSE:To position a die accurately at the center of an optical system for recognition by pressing the die to a guide located as specified with a guide click which is fixed on a guide device which can slide in the X/Y directions against an inner lead bonder. CONSTITUTION:An X direction positioning guide 20 and a Y direction positioning guide 21 are fixed horizontally at 90 deg. each other on a die base 19. A slider 25 is moved to the X direction through a cam lever 5 which is fixed at the slider 25 corresponding to the rotation of a cam 4. A slider 10 is moved to the Y direction through a guide groove 9 which is fixed at the slider 10 and a cam layer 6 which rotates centering around a pillar 7 which is fixed at a base 1 corresponding to the rotation of a cam 3. A guide click 17 is thereby moved to X and Y directions. That is, the guide click 17 moves forward in the Y direction at first then moves backward after pressing a die 18 to a guide 21; then it moves forward in the X direction then moves backward after pressing a die 8 to a guide 20. In this way, a die can be positioned accurately at the center of an optical system for recognition.</p>
申请公布号 JPH0195531(A) 申请公布日期 1989.04.13
申请号 JP19870252534 申请日期 1987.10.08
申请人 TOSHIBA CORP 发明人 FUJITA SHIGEKI;IKETANI YUKIHIRO
分类号 H01L21/68;H01L21/60 主分类号 H01L21/68
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