| 摘要 |
PURPOSE:To easily perform the housing of the case of an electronic component with a few amount of energy efficiently by forming two areas of low and high crystallinities on each of a pair of upper and lower cases, and depositing the pair of cases at the area of low crystallinity with each other. CONSTITUTION:At the time of forming the case by using a male metallic die 23 whose vertical cross section is formed in projecting shape and a female metallic die 24 whose vertical cross section is formed in recessed shape and supplying a thermoplastic resin material such as polyphenylene sulfide(PPS), polycarbonate, or polyacetal, etc., between the male metallic die 23 and the female metallic die 24, molding is performed by keeping the male metallic die 23 is kept at a temperature less than the recrystallization temperature in crystallization degree of the thermoplastic resin material 25, and keeping the female metallic die 24 at the temperature over the recrystallization temperature of the thermoplastic resin material 25. In such a way, superior adhesion and high adhesive strength in the cases 26 and 27 can be obtained. And thermoplastic resin at the deposited part of the cases 26 and 27 can be highly crystallized by the heat of the frame body 13 of a terminal frame 12. |
