| 摘要 |
phe invention concerns a device for the release of substances made of hot-melt adhesives, with uniform or non-uniform distribution of the substances. The hot-melt adhesive has a processing temperature between 40 and 80 degrees Celsius, preferably between 40 and 60 degrees Celsius, and ideally between 40 and 55 degrees Celsius. Also described is a process for manufacturing the device in which the melted hot melt-adhesive containing the substances to be released is applied continuously or intermittently to a support at a hot-melt adhesive temperature between 40 and 80 degrees Celsius, preferably 40 and 60 degrees Celsius, and ideally 45 and 55 degrees Celsius, and in which, if necessary, a protective coating material is applied. |
