| 摘要 |
<p>PURPOSE:To obtain a semiconductor package substrate excellent in reliability by a method wherein substrates are laminated into one piece through the intermediary of a bonding agent, a cavity is provided, and a removable protective film is previously formed on a circuit pattern exposed part at the formation of the cavity. CONSTITUTION:Substrates 10 and 12 are both sides copper plated glass epoxy substrates, and a circuit pattern 16 is formed on the substrate 10 using a resist mask. A protective film 18 is formed on a part of the circuit pattern 16 which is to be exposed at the formation of a cavity 20 on a substrate 11. Next, the substrate 12 is overlapped to the substrate 11 through the intermediary of an adhesive sheet 14, which are laminated into one piece by pressure as they are heated. Then, the cavity 20 is formed and the protective film 18 is removed. The removal of the film 18 is performed concurrently at the same time when the cavity 20 is formed or the film 18 is melted away later. Ni is plated on the exposed part of the circuit pattern 16 and all processes are completed after gold is plated thereon.</p> |
