发明名称 PROCESS FOR MAKING CIRCUIT BOARDS
摘要 <p>An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.</p>
申请公布号 EP0153683(B1) 申请公布日期 1989.04.12
申请号 EP19850101732 申请日期 1985.02.16
申请人 BAYER AG 发明人 SIRINYAN, KIRKOR, DR.;WOLF, GERHARD DIETER, DR.;VON GIZYCKI, ULRICH, DR.;MERTEN, RUDOLF, DR.
分类号 C23C18/16;C23C18/28;C23C18/30;H05K3/18;H05K3/24;(IPC1-7):H05K3/18;H05K3/38 主分类号 C23C18/16
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