发明名称 |
PROCESS FOR MAKING CIRCUIT BOARDS |
摘要 |
<p>An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.</p> |
申请公布号 |
EP0153683(B1) |
申请公布日期 |
1989.04.12 |
申请号 |
EP19850101732 |
申请日期 |
1985.02.16 |
申请人 |
BAYER AG |
发明人 |
SIRINYAN, KIRKOR, DR.;WOLF, GERHARD DIETER, DR.;VON GIZYCKI, ULRICH, DR.;MERTEN, RUDOLF, DR. |
分类号 |
C23C18/16;C23C18/28;C23C18/30;H05K3/18;H05K3/24;(IPC1-7):H05K3/18;H05K3/38 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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