| 摘要 |
PURPOSE:To increase the processing capacity by a method wherein a semiconductor chip held on an exposed seat and the loading position of semiconductor chip on a substrate are opposed to each other holding an alignment hole of an alignment mechanism 14 and then the actuator of chip releasing mechanism 13 is actuated to guide the chip released from the seat into the alignment hole. CONSTITUTION:Firstly, two pairs of XY shifting mechanisms 3 and 12 are actuated to shift an expand seat 4 and a substrate stage 10 so that a free chip 7 to be loaded which is held on the lower surface of the seat 4 and the loading position of a substrate 11 may be opposed to each other holding an alignment hole 19. A plunger pin 17 is lowered in such a state to release a chip 7 from the seat 4 by the driving part 16 of the pin 17 so that the chip 7 may be pressed down on the specified surface of the substrate 11 through the alignment hole 19 to bring the bump 21 of the pin 17 into contact with the substrate surface 11. Later, the plunger 17 is lifted up to shift the seat 4 and the stage 10 by the shifting mechanisms 3,12 repeating the same operations to load the substrate 11 with the next chip 7. Through these procedures, the processing manhours can be cut down while minimizing the errors in the chip mounting operations. |
