发明名称 Bonding method employing polyamide oligomer-epoxy polymer adhesives
摘要 Compositions for the preparation of thermosetting or thermoplastic polymers, which compositions comprise a mixture of at least one polyepoxide and at least one polyamide oligomer, wherein the oligomer is a primary monoamine, an alpha,omega-primary or -secondary diamine, an alpha,omega-diacid or an alpha-primary amine,omega-acid, together with process for preparing polymers and the uses of such materials for molding and for adhesives.
申请公布号 US4820367(A) 申请公布日期 1989.04.11
申请号 US19870056385 申请日期 1987.06.01
申请人 ATOCHEM 发明人 CUZIN, DANIEL
分类号 C08G59/00;C08G59/44;C08G59/54;C08L63/00;C08L77/00;(IPC1-7):B32B31/00 主分类号 C08G59/00
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