发明名称 PHOTOSENSITIVE SOLDER RESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive solder resist composition having good storage stability and high moisture-heat resistance.SOLUTION: The photosensitive solder resist composition comprises (A) a block isocyanate silane obtained by reacting an isocyanate compound represented by general formula (I) below with a blocking agent, (B) a curable resin, (C) a diluent, (D) a polymerization initiator, and (E) a filler. In the formula, Rrepresents an alkyl group having 1 to 8 carbon atoms; n represents a number of 1 to 10; a represents a number of 1 to 3; and b represents a number of 0 to 2 satisfying a+b=3.SELECTED DRAWING: None
申请公布号 JP2016145866(A) 申请公布日期 2016.08.12
申请号 JP20150021983 申请日期 2015.02.06
申请人 ADEKA CORP 发明人 SHINOZUKA TOYOJI
分类号 G03F7/075;G03F7/004;H05K3/28 主分类号 G03F7/075
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