| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique related to a wafer bonding device and a wafer bonding method, which allows for efficient bonding of wafers, while maintaining the bonding surface of the wafers in good state.SOLUTION: A wafer bonding device for bonding wafers in vacuum or in a replacement gas atmosphere includes a transport section for transporting a wafer between a load lock chamber and a wafer storage container, a load lock chamber capable of accommodating an upper wafer, a lower wafer and a bonded wafer one by one, a bonding chamber connected with the load lock chamber via a gate valve, and a transfer section for transferring the wafer between the load lock chamber and bonding chamber. A wafer bonding method using the wafer bonding device is also provided.SELECTED DRAWING: Figure 1 |
