| 发明名称 |
Method of making a packaged IC chip |
| 摘要 |
A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments. |
| 申请公布号 |
US4820658(A) |
申请公布日期 |
1989.04.11 |
| 申请号 |
US19880203529 |
申请日期 |
1988.05.23 |
| 申请人 |
GTE PRODUCTS CORPORATION |
发明人 |
GILDER, JR., THOMAS G.;O'DEAN, RAYMOND D. |
| 分类号 |
H01L23/495;(IPC1-7):H01L21/66 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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