| 摘要 |
<p>PURPOSE:To perform accurate wire bonding or surface mounting on a plurality of surfaces by integrating a plurality of circuit substrates into one in a laminating direction as a multilayer circuit substrate. CONSTITUTION:Substrates 1, 2 on which various elements 5 are mounted are laminated rear-to-rear at the rear faces of the substrates 1, 2 to be mounted. Connecting patterns 3 are provided on the end faces of the substrates 1, 2, which are connected to lead frames 4 each having a clamping mechanism. Thus, a plurality of surfaces are accurately wire-bonded or surface-mounted.</p> |
