Printed circuit board with a metal layer-support body (substrate), on which a flat insulation layer and on top of this a layer having individual metal conductor tracks for connecting electrical components are provided. At least one indentation for holding a component is impressed into the printed circuit board. The component can therefore be positioned exactly in a simple manner. <IMAGE>
申请公布号
DE3831551(A1)
申请公布日期
1989.04.06
申请号
DE19883831551
申请日期
1988.09.16
申请人
PAPST-MOTOREN GMBH & CO KG, 7742 ST GEORGEN, DE
发明人
CAP, HEINRICH, ING.(GRAD.), 7742 ST GEORGEN, DE;MOOSMANN, GEORG, 7741 TENNENBRONN, DE