| 摘要 |
The application of the flux by spraying results in the disadvantage that the flux passes to the component side. When flux applicator blocks are used, the relative clogging of the blocks and the limited cleaning possibilities of the blocks must be taken into account. The new soldering device is intended to make it possible to apply the flux uniformly without any major outlay. To this end, the flux applicator consists of an ultrasound horn which ends underneath the surface of the flux bath, and the transportation device is constructed in such a manner that that surface of the printed circuit board to be soldered can be guided at a predetermined distance from the surface of the flux. The flux applicator can be used advantageously as an upstream flux wetting device, in the context of a soldering device.
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