发明名称 |
HERMETISCH DICHTES GLAS-METALLGEHAEUSE FUER HALBLEITERBAUELEMENTE UND VERFAHREN ZU DESSEN HERSTELLUNG |
摘要 |
A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap. |
申请公布号 |
DE3732075(A1) |
申请公布日期 |
1989.04.06 |
申请号 |
DE19873732075 |
申请日期 |
1987.09.23 |
申请人 |
SIEMENS AG;ELECTROVAC,FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GES. MBH |
发明人 |
WAITL,GUENTHER;BIRKMANN,ROLF;SCHMIDT,EWALD |
分类号 |
H01L23/02;H01L31/0203;H01L31/0232;H01L33/48;H01L33/58 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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